Johannes Schubert, M.Sc.

In mechatronic assemblies, future developments require smaller installation spaces and lead therefore to increasing demands on Mechatronic Integrated Devices (MID), e.g., for aerospace industry. Since thermoplastic substrates and conventional production techniques like Injection Molding cannot fulfill these demands, additive manufacturing of ceramics seems to be a promising approach. However, processes to integrate electrical conductors into the ceramic bodies still have to be developed. This paper provides first steps for solving this problem. First, ideas are systematically searched, evaluated by means of a SWOT analysis and elaborated into detailed concepts considering possible process chains. The most promising concepts are investigated experimentally focusing on (i) pouring molten conductor material and (ii) inserting conductor wires into capillaries located in the ceramic body as well as (iii) manufacturing of aluminum oxide-copper-composites by active metal brazing. This paper is a starting point for detailed studies of the most promising concept ?pouring molten conductor material?.

Future developments lead to increasing demands on mechatronic integrated devices (MID). Therefore, ceramics have to be used as substrate material and conductor tracks have to be located in the interior of components to be sufficiently protected. A process combination of vat photopolymerization (VPP-LED) and vacuum die casting is investigated for realizing such structures. First, optimized process parameters are derived by studying the filling behavior of straight capillaries. Subsequently, the results are transferred to complex additively manufactured substrates to derive design guidelines.